17 November 2026 5:30PM-7:30PM (PST)
An Introduction to 1D Coupled 3D Lifecycle Simulation
Digital engineering has made significant progress connecting requirements, architecture, design, simulation, and test. Yet engineering organizations must divide the problem among disciplines while the product operates as one physical system. How do we preserve the evolving interactions between those disciplines throughout a mission and across the product’s life?
Abstract: This presentation explores 1D Coupled 3D Lifecycle Simulation as an approach to strengthening that connection. Topics include causal and acausal modeling, interacting physics operating on different time scales, and the interpretation required as states and boundary conditions move between specialized models. The discussion will explore how mission architecture, multidomain system simulation, detailed 3D physics, and test evidence can work together to evaluate design changes, degradation, maintenance, modular component alternatives and the opportunity to evaluate a basis for Modular Open Systems Approach (MOSA).
The emphasis is on augmenting existing engineering investments and turning connected information into executable mission and lifecycle evidence. A follow-on hands-on workshop will be held virtually on Saturday, November 21, from 9:00 a.m. to 1:00 p.m. Pacific Time, enabling members throughout the greater Los Angeles area to participate and apply these concepts.
Speaker: Mark TenEyck, Dassault Systèmes
Mark TenEyck brings more than 30 years of experience across business leadership, design, fabrication, and engineering technology, including a longstanding career with Dassault Systèmes. A speaker, educator, and mentor, he focuses on helping organizations improve product development while reducing cost, waste, and environmental impact.